1. Theory
- Definition: TCAD mobility models give the carrier mobility at every mesh point as a function of doping, temperature, the field perpendicular to the current near interfaces, and the field along the current (Allpix; COMSOL).
- Low-field bulk mobility: Phonon scattering sets the lattice mobility, and ionized impurities reduce it at high doping, described by Masetti or Arora (Caughey-Thomas type) fits (Allpix; nextnano).
- Surface mobility: In inversion layers, acoustic phonons and surface roughness lower the mobility further as the perpendicular field rises, combined by Matthiessen’s rule in the Lombardi model (COMSOL).
- High-field mobility: At high driving fields the drift velocity saturates near , described by the Caughey-Thomas form with Canali parameters (Allpix).
- Composition: Simulators combine the effects, typically using the low-field and surface terms as the input mobility of the high-field model (Allpix; COMSOL; background knowledge for the ordering).
2. Working Principle
- Scattering rates add: Independent scattering mechanisms add their rates, so the inverse mobilities add (COMSOL; background knowledge for the rate argument).
- Impurity scattering: Coulomb scattering from ionized dopants dominates above about , halving the electron mobility there (Allpix; computed).
- Interface effects: A stronger gate field pulls carriers against the oxide, where roughness and surface phonons scatter them (COMSOL; background knowledge for the mechanism).
- Velocity saturation: Carriers heated by the field emit optical phonons, which caps the velocity (background knowledge; Allpix).
3. Applications
- MOSFET simulation: Lombardi with Masetti and Canali for drain current and saturation (COMSOL; Allpix).
- Particle detectors: Jacoboni-Canali and Hamburg models for charge collection in silicon sensors (Allpix).
- Power and bipolar devices: Doping- and temperature-dependent mobility for drift regions and bases (Allpix; Temperature Scaling page).
- Calibration: Fitting surface-mobility parameters to measured effective mobility (COMSOL; background knowledge).
Low-Field Bulk Mobility
| Name | Formula | Related Formulae | Variables/Constants |
|---|---|---|---|
| Masetti doping-dependent mobility | |||
| Arora (Caughey-Thomas type) mobility |
Surface Mobility
| Name | Formula | Related Formulae | Variables/Constants |
|---|---|---|---|
| Lombardi surface (transverse-field) mobility |
High-Field Mobility
| Name | Formula | Related Formulae | Variables/Constants |
|---|---|---|---|
| Caughey-Thomas / Canali high-field mobility | |||
| Saturation velocity and its temperature dependence |
Important Questions
Ques: How much does doping reduce silicon mobility?
By more than an order of magnitude at heavy doping. With the Masetti parameters for arsenic-doped electrons and boron-doped holes listed by Allpix, the electron mobility is 1404 at , 727 at , 108 at and 61 at , and the hole mobility 469, 319, 73 and 50 (computed). The Arora form gives similar values, 1337, 777, 114 and 92 for electrons (computed), but it lacks Masetti’s extra high-doping term , which lowers the mobility above about , so the two differ most there, 61 against 92. Electron mobility halves near , close to the reference concentration . The Masetti model is valid at 300 in nextnano’s implementation, while Arora carries explicit temperature exponents. Reference: Allpix Squared collaboration, ‘Charge Carrier Mobility’, Allpix Squared documentation, CERN (models after Jacoboni et al. 1977, Canali et al. 1975, Masetti et al. 1983, Arora et al. 1982, the Hamburg model 2015, Ruch and Kino, and Quay et al.) (fetch-tool summary); nextnano GmbH, ‘mobility_masetti’, nextnano++ database documentation (parameters from the DESSIS manual 2001; equation placeholder only) (fetch-tool summary).
Ques: Is the Masetti electron Cs or ?
The sources disagree by a digit transposition. Allpix lists for arsenic-doped electrons, while nextnano, quoting the DESSIS manual, gives ; all other electron values (52.2, 1417, , 0.68, 43.4, 2.0) agree. The two differ by 2.7 per cent (computed), and since only enters the high-doping correction, the computed mobility at changes by under 1 (computed), so the practical impact is negligible. Masetti et al.’s original arsenic value is generally quoted as (background knowledge), and the phosphorus value of in Allpix is close to it, so is more likely correct and a transcription slip (my reading). Reference: Allpix Squared collaboration, ‘Charge Carrier Mobility’, Allpix Squared documentation, CERN (models after Jacoboni et al. 1977, Canali et al. 1975, Masetti et al. 1983, Arora et al. 1982, the Hamburg model 2015, Ruch and Kino, and Quay et al.) (fetch-tool summary); nextnano GmbH, ‘mobility_masetti’, nextnano++ database documentation (parameters from the DESSIS manual 2001; equation placeholder only) (fetch-tool summary).
Ques: Is the lattice-limited electron mobility of silicon 1417 or about 1530?
Both are used, from different fits. Masetti’s arsenic set, also used in Bortolossi’s TCAD test case, has , and the phosphorus set 1414, while the Hamburg model lists 1530 for <100> electrons and Jacoboni-Canali’s low-field limit is at 300 (computed). Masetti fitted resistivity data across doping levels, while Jacoboni and the Hamburg group fitted drift velocities in high-purity silicon (background knowledge for the data types). The 8 per cent difference therefore reflects the purpose: the Masetti values describe doped device regions, and the higher values describe lightly doped detector silicon (my reading). For devices doped above about the difference shrinks, because impurity scattering already dominates. Reference: Allpix Squared collaboration, ‘Charge Carrier Mobility’, Allpix Squared documentation, CERN (models after Jacoboni et al. 1977, Canali et al. 1975, Masetti et al. 1983, Arora et al. 1982, the Hamburg model 2015, Ruch and Kino, and Quay et al.) (fetch-tool summary); A. Bortolossi, ‘3D Finite Element Drift-Diffusion Simulation of Semiconductor Devices’, Politecnico di Milano thesis (2014) (fetch-tool summary).
Ques: How does the Lombardi model describe inversion-layer mobility?
As three scattering mechanisms added by Matthiessen’s rule. COMSOL writes , where is the doping-dependent bulk mobility, an acoustic-phonon term that falls with the perpendicular field and temperature, and a surface-roughness term, with in V/s. Doubling the perpendicular field cuts the roughness term four times (computed), so roughness dominates at high gate voltage and phonons at low. Combining 1000, 500 and 800 gives 235 (computed), lower than any single term. In COMSOL’s 2-D MOSFET example, with a 5 oxide and channel doping, the model lowers the current and sharpens saturation compared with constant mobility, reducing mobility near the gate. Reference: COMSOL, ‘Lombardi Surface Mobility’ application model documentation, Semiconductor Module 6.4 (equations garbled in the extract; after Lombardi et al., IEEE Trans. CAD 7(11), 1988) (fetch-tool summary); COMSOL, ‘Mobility Models’, Semiconductor Module User’s Guide 6.4 (equations as images; parameter values not in the text) (fetch-tool summary).
Ques: How does high-field mobility produce velocity saturation?
Through , so the velocity tends to . With the Jacoboni-Canali silicon electron parameters listed by Allpix at 300 , , and , the mobility falls from 1389 at to 674 at , 303 at and 102 at , while the velocity rises from to , and (computed). Holes saturate more softly, with and (computed). In a 100 channel at 1 the average field is (computed), so short-channel devices operate near saturation, which is why the driving-field choice matters. Reference: Allpix Squared collaboration, ‘Charge Carrier Mobility’, Allpix Squared documentation, CERN (models after Jacoboni et al. 1977, Canali et al. 1975, Masetti et al. 1983, Arora et al. 1982, the Hamburg model 2015, Ruch and Kino, and Quay et al.) (fetch-tool summary).
Ques: What is the saturation velocity of electrons in silicon?
About at room temperature, with sources spreading by 7 per cent. Allpix’s model set gives from Jacoboni et al., from Canali et al., which changes only the prefactor from to , from the Hamburg model and from Quay et al. (computed at 300 ). The spread reflects different samples and fitting ranges rather than physics (my reading), and is the usual design value (background knowledge). The velocity falls with temperature because phonon emission increases: Quay’s law with A = 0.74 gives at 400 , 20 per cent lower (computed), and holes saturate at about with a weaker temperature dependence, A = 0.37. Reference: Allpix Squared collaboration, ‘Charge Carrier Mobility’, Allpix Squared documentation, CERN (models after Jacoboni et al. 1977, Canali et al. 1975, Masetti et al. 1983, Arora et al. 1982, the Hamburg model 2015, Ruch and Kino, and Quay et al.) (fetch-tool summary).
References
- Allpix Squared collaboration, “Charge Carrier Mobility,” Allpix Squared documentation, CERN. Available: https://allpix-squared.docs.cern.ch/docs/06_models/02_carrier_mobility
- nextnano GmbH, “mobility_masetti,” nextnano++ database documentation. Available: https://nextnano.com/nextnanoplus/software_documentation/database/mobility_masetti.htm
- A. Bortolossi, “3D Finite Element Drift-Diffusion Simulation of Semiconductor Devices,” Laurea Magistrale thesis, Politecnico di Milano, 2014. Available: https://www.politesi.polimi.it/retrieve/a81cb05a-eff6-616b-e053-1605fe0a889a/2014_7_Bortolossi.pdf
- COMSOL, “Lombardi Surface Mobility,” Semiconductor Module application model documentation, version 6.4. Available: https://doc.comsol.com/6.4/doc/com.comsol.help.models.semicond.lombardi_surface_mobility/models.semicond.lombardi_surface_mobility.pdf
- COMSOL, “Mobility Models,” Semiconductor Module User’s Guide, version 6.4. Available: https://doc.comsol.com/6.4/doc/com.comsol.help.semicond/semicond_ug_semiconductor.6.57.html
Related pages in this vault: Generation-Recombination Models, Temperature Scaling, Band-Gap Narrowing and Quantum Corrections, Drift-Diffusion Device Equations, Hydrodynamic and Energy-Balance Transport, Hall Effect System, Spreading Resistance Profiler (SRP), Four-Point Probe, Thermal and Electro-Thermal Simulation.